Mechanical Behavior Measurement of Electronic Devices by Moiré Interferometry under Thermal Cycle Test
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چکیده
منابع مشابه
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ژورنال
عنوان ژورنال: JSME International Journal Series A
سال: 2002
ISSN: 1344-7912,1347-5363
DOI: 10.1299/jsmea.45.232